Grazing incidence interaction of Sn particles with EUV Lithography ruthenium mirrors
Valentino Rigato

TL;DR
This study investigates how tin particles at various energies and angles interact with ruthenium mirrors used in EUV lithography, aiming to understand and mitigate mirror degradation caused by debris from tin plasma sources.
Contribution
It provides a detailed computational analysis of Sn particle interactions with Ru mirrors at grazing incidence, enhancing understanding of surface modifications during EUV lithography.
Findings
Sn particles cause surface modifications on Ru mirrors.
Energy and angle of Sn particles influence sputtering and reflection.
Modeling predicts surface evolution under Sn flux.
Abstract
The new EUV Lithography tools for IC High Volume Manufacture at 22nm make use of EUV radiation at \lambda = 13.5nm. High power Laser (LPP) and Discharge (DPP)EUV light sources are based on Sn plasmas for the optimum conversion of electrical power to in-band radiation. Sn-fueled sources emit debris such as Sn particles in a rather wide energy spectrum: from thermalized Sn to several tens keV fast ions. Tin interaction with the collector mirrors surfaces facing the high power EUV light source leads to the degradation of the optical performance and productivity of the litho tool, therefore debris must be suppressed and the surface modification of the mirror materials during the particle irradiation must be carefully investigated both theoretically and experimentally. For DPP Sn-fueled sources the collector is a grazing incidence mirror that reflects the EUV light in the grazing angle range…
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Taxonomy
TopicsAdvancements in Photolithography Techniques · Integrated Circuits and Semiconductor Failure Analysis · Electron and X-Ray Spectroscopy Techniques
