Capacitance modeling of complex topographical silicon quantum dot structures
H. L. Stalford (1, 3), R. Young (1), E. P. Nordberg (1, 2),, James. E. Levy (1), Carlos Borras Pinilla (3), M. S. Carroll (1) ((1) Sandia, National Laboratory, (2) University of Wisconsin-Madison, University of, Oklahoma (3))

TL;DR
This paper develops a 3D classical capacitance model for complex silicon quantum dot structures, demonstrating good agreement with experimental measurements and analyzing the impact of structural variations on capacitance accuracy.
Contribution
It introduces a comprehensive 3D capacitance modeling approach combining simulation and CAD, improving accuracy for complex multi-QD structures.
Findings
Capacitance agreement within 10-20% for complex geometries
Structural variations explain most discrepancies
Metal-insulator transition density approximates quantum dot edge
Abstract
Quantum dot (QD) lay-outs are becoming more complex as the technology is being applied to more complex multi-QD structures. This increase in complexity requires improved capacitance modeling both for design and accurate interpretation of QD properties from measurement. A combination of process simulation, electrostatic simulation, and computer assisted design (CAD) lay-out packages are used to develop a three dimensional (3D) classical capacitance model. The agreement of the capacitances of the classical model is tested against two different, experimentally measured, topographically complex silicon QD geometries. Agreement with experiment, within 10-20%, is demonstrated for the two structures when the details of the structure are transferred from the CAD to the model capturing the full 3D topography. Small uncertainty in device dimensions due to uncontrolled variation in processing,…
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Taxonomy
TopicsQuantum and electron transport phenomena · Semiconductor materials and devices · Advancements in Semiconductor Devices and Circuit Design
