Simulation of interstitial diffusion of ion-implanted boron
O.I. Velichko, N.V. Kniazhava

TL;DR
This paper presents a model for simulating the interstitial diffusion of ion-implanted boron during rapid thermal annealing in silicon, incorporating effects of cluster dissolution and elastic stresses, validated by experimental data.
Contribution
A novel model for boron interstitial diffusion during annealing that accounts for cluster dynamics and elastic stresses, validated by simulation and experimental agreement.
Findings
Average migration length of boron interstitials is 12 nm.
Approximately 1.96% of boron atoms participate in interstitial migration.
Simulation results match experimental boron profiles after annealing.
Abstract
A model of the interstitial diffusion of ion-implanted boron during rapid thermal annealing of silicon layers previously amorphized by implantation of germanium has been proposed. It is supposed that the boron interstitials are generated continuously during annealing due to dissolution or rearrangement of the clusters of impurity atoms which are formed in the ion-implanted layers with impurity concentration above the solubility limit. The local elastic stresses arising due to the difference of boron atomic radius and atomic radius of silicon also contribute to the generation of boron interstitials. On the basis of the model proposed a simulation of redistribution of ion-implanted boron during rapid thermal annealing with duration of 60 s at a temperature of 850 degrees Celsius has been carried out. The calculated profile of boron distribution after thermal treatment agrees well with the…
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Taxonomy
TopicsSilicon and Solar Cell Technologies · Semiconductor materials and interfaces · Advancements in Semiconductor Devices and Circuit Design
