Development of Vertically Integrated Circuits for ILC Vertex Detectors

TL;DR

This paper discusses the development and testing of vertically integrated 3D electronics for particle physics detectors, including technology exploration, prototype creation, and future fabrication plans.

Contribution

It presents the first 3D chip for particle physics and details advancements in interconnect technology and fabrication processes.

Findings

Successful production of the first 3D chip for particle physics

Advancements in interconnect technology and backside thinning

Plans for commercial two-tier 3D fabrication run

Abstract

We report on studies of vertically interconnected electronics (3D) performed by the Fermilab pixel group over the past two years. These studies include exploration of interconnect technology, backside thinning and laser annealing, the production of the first 3D chip for particle physics, the VIP, and plans for a commercial two-tier 3D fabrication run.