Monolithic Pixel Sensors in Deep-Submicron SOI Technology with Analog and Digital Pixels
Marco Battaglia, Dario Bisello, Devis Contarato, Peter Denes, Piero, Giubilato, Lindsay Glesener, Serena Mattiazzo, Chinh Vu

TL;DR
This paper reports on the design, fabrication, and testing of a monolithic pixel sensor in deep-submicron SOI CMOS technology, demonstrating its potential for high-resolution imaging with both analog and digital pixels.
Contribution
It introduces a novel monolithic pixel sensor in deep-submicron SOI technology with integrated analog and digital pixels on a 10 micron pitch.
Findings
Successful fabrication of the prototype chip in 0.15 micron SOI process.
Effective detection of infrared laser and 1.35 GeV electrons.
Initial assessment of radiation effects on the sensor.
Abstract
This paper presents the design and test results of a prototype monolithic pixel sensor manufactured in deep-submicron fully-depleted Silicon-On-Insulator (SOI) CMOS technology. In the SOI technology, a thin layer of integrated electronics is insulated from a (high-resistivity) silicon substrate by a buried oxide. Vias etched through the oxide allow to contact the substrate from the electronics layer, so that pixel implants can be created and a reverse bias can be applied. The prototype chip, manufactured in OKI 0.15 micron SOI process, features both analog and digital pixels on a 10 micron pitch. Results of tests performed with infrared laser and 1.35 GeV electrons and a first assessment of the effect of ionising and non-ionising doses are discussed.
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