The mechanism of ion induced amorphization in Si
H. P. Lenka, U. M. Bhatta, P. K. Kuiri, G. Sahu, B. Joseph, B. Satpati, and D. P. Mahapatra

TL;DR
This paper investigates how ion impacts induce amorphization in silicon, revealing that at low energies it occurs via nucleation and growth, with a higher threshold dose than simulations predict, possibly due to temperature effects.
Contribution
It provides experimental insights into the ion-induced amorphization mechanism in silicon, highlighting a nucleation and growth process and a higher amorphization threshold than previously simulated.
Findings
Amorphization occurs via nucleation and growth at low energies.
The growth process is diffusion limited with an Avrami exponent of ~1.6.
The amorphization threshold dose exceeds 17 eV/atom, higher than simulation predictions.
Abstract
Some results on damage build up in, and amorphization of, Si, induced by 25-30 keV Al, Si and Cs ions, at room temperature, are reported. We show that at low energy, amorphization is a nucleation and growth process, based on the direct impact mechanism. With an Avrami exponent , the growth towards amorphization seems to be diffusion limited. A transition to a completely amorphized state is indicated at a dose exceeding 17 eV/atom, which is higher than 6-12 eV/atom as predicted by simulations. The observed higher threshold could be due to temperature effects although an underestimation of keV-energy recoils, in simulation, may not be ruled out.
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Taxonomy
TopicsSilicon and Solar Cell Technologies · Ion-surface interactions and analysis · Thin-Film Transistor Technologies
