Multiple-Retrapping Process in High-$T_c$ Intrinsic Josephson Junctions

TL;DR

This paper investigates the switching-current distribution in high-$T_c$ intrinsic Josephson junctions, revealing a temperature-dependent behavior explained by a multiple-retrapping model rather than thermal activation.

Contribution

It introduces a multiple-retrapping model to explain the temperature dependence of SWCD in high-$T_c$ Josephson junctions, challenging the thermal-activation paradigm.

Findings

SWCD width increases as temperature decreases down to 1.5 K

The quality factor in the phase-diffusion regime influences SWCD behavior

Quantitative agreement with the multiple-retrapping model

Abstract

We report measurements of switching-current distribution (SWCD) from a phase-diffusion branch to a quasiparticle-tunneling branch as a function of temperature in a cuprate-based intrinsic Josephson junction. Contrary to the thermal-activation model, the width of the SWCD increases with decreasing temperature, down to 1.5 K. Based on the multiple-retrapping model, we quantitatively demonstrate that the quality factor of the junction in the phase-diffusion regime determines the observed temperature dependence of the SWCD.