Thermal Conductivity of Thermally-Isolating Polymeric and Composite Structural Support Materials Between 0.3 and 4 K
M.C. Runyan, W.C. Jones

TL;DR
This study measures the low-temperature thermal conductivity of various polymeric and composite materials between 0.3 and 4 K to evaluate their suitability as thermally-isolating structural supports.
Contribution
It provides new low-temperature thermal conductivity data for several polymeric and composite materials relevant to cryogenic support applications.
Findings
Vespel SP-1 and SP-22 show low thermal conductivity at cryogenic temperatures.
Composite materials like G-10/FR-4 and fiberglass have moderate thermal conductivities.
Data supports selecting materials for cryogenic structural supports based on thermal performance.
Abstract
We present measurements of the low-temperature thermal conductivity of a number of polymeric and composite materials from 0.3 to 4 K. The materials measured are Vespel SP-1, Vespel SP-22, unfilled PEEK, 30% carbon fiber-filled PEEK, 30% glass-filled PEEK, carbon fiber Graphlite composite rod, Torlon 4301, G-10/FR-4 fiberglass, pultruded fiberglass composite, Macor ceramic, and graphite rod. These materials have moderate to high elastic moduli making them useful for thermally-isolating structural supports.
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