Package Hermeticity Testing with Thermal Transient Measurements

TL;DR

This paper discusses a method for testing the hermeticity of packages using thermal transient measurements to ensure reliability in humid environments, crucial for MEMS and smart sensors.

Contribution

It introduces a novel thermal transient measurement technique for assessing package hermeticity, addressing the need for reliable testing in modern electronic devices.

Findings

Thermal transient measurements can effectively detect moisture ingress.

The method improves reliability testing accuracy for hermetic packages.

It offers a non-destructive testing approach for package hermeticity.

Abstract

The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture into the package may result in internal corrosion or shift of the operating parameters, the reliability testing of hermetically sealed packages has become a crucial question in the semiconductor industry.