High Density out-of-Plane Microprobe Array

TL;DR

This paper discusses the development of high-density out-of-plane microprobe arrays using MEMS technology, focusing on the design and fabrication of cantilever-based microstructures for MEMS devices.

Contribution

It introduces a novel high-density out-of-plane microprobe array leveraging MEMS fabrication techniques, emphasizing cantilever structures for improved device integration.

Findings

Successful fabrication of high-density microprobe arrays

Enhanced performance of MEMS devices with out-of-plane structures

Simplified design and manufacturing process

Abstract

MEMS technology has been developed rapidly in the last few years. More and more special micro structures were discussed in several publications. However, all of the structures were produced by consist of the three fundamental structures, which included bridge, cantilever and membrane structures. Even the more complex structures were no exception. The cantilever with the property of simple design and easy fabrication among three kinds of fundamental structure, therefore, it was popular used in the design of MEMS device.