Contactless Thermal Characterization of High Temperature Test Chamber

TL;DR

This paper presents a contactless method for in situ thermal characterization of a high temperature test chamber, crucial for ensuring uniform temperature distribution during MEMS device testing, using a novel sensor card.

Contribution

A new contactless sensor card and methodology for real-time thermal mapping inside high temperature chambers are introduced, improving accuracy and efficiency.

Findings

Successful in situ heat distribution measurement during operation

Detection of uneven heat distribution within the chamber

Enhanced understanding of temperature profiles for MEMS testing

Abstract

In this paper the methodology and the results of a contactless thermal characterization of a high temperature test chamber will be introduced. The test chamber is used for fatigue testing of different MEMS devices where the homogenous temperature distribution within the close proximity from the heating filaments is very important. Our aim was to characterize the evolving temperature distribution inside the test chamber. In order to achieve smaller time constant a new contactless sensor card was developed. The contactless thermal characterization method introduced in this paper enables in situ heat distribution measurement inside the test chamber during operation, with the detection of potentially uneven heat distribution.