Structural, magnetic and mechanical properties of 5 $\mu$m thick SmCo films for use in Micro-Electro-Mechanical-Systems

TL;DR

This study investigates the deposition of 5 μm thick SmCo films on silicon substrates, optimizing conditions for magnetic, structural, and mechanical properties suitable for MEMS applications.

Contribution

It identifies optimal deposition temperature and methods to produce mechanically stable, high-quality SmCo films compatible with MEMS integration.

Findings

Optimal properties at 350°C deposition temperature.

Increased deposition rate with larger target surface area.

Mechanically stable films via pre-patterned or masked deposition.

Abstract

5$\mu$m thick SmCo films were deposited onto Si substrates using triode sputtering. A study of the influence of deposition temperature (Tdep <= 600 degrees C) on the structural, magnetic and mechanical properties has shown that optimum properties (highest degree of in-plane texture, maximum in-plane coercivity and remanence (1.3 and 0.8 T, respectively), no film peel-off) are achieved for films deposited at the relatively low temperature of 350 degrees C. This temperature is compatible with film integration into Micro-Electro-Mechanical-Systems (MEMS). The deposition rate was increased from 3.6 to 18 $\mu$m/h by increasing the surface area of the target from 7 to 81 cm2. Mechanically stable films could be prepared by deposition onto pre-patterned films or deposition through holes in a mask.