Condensation and growth of Kirkendall voids in intermetallic compounds

TL;DR

This paper introduces a comprehensive model for simulating Kirkendall void formation and growth in metallic materials, considering vacancy diffusion and deformation, with applications to microelectronics reliability and solder joint failure analysis.

Contribution

It presents a new constitutive model for void nucleation and growth that predicts void evolution during thermal cycling in solder joints.

Findings

Model successfully simulates void growth over time.

Numerical studies demonstrate potential for failure analysis.

Model enhances understanding of voiding in intermetallic compounds.

Abstract

A model for the simulation of Kirkendall voiding in metallic materials is presented based on vacancy diffusion, elastic-plastic and rate-dependent deformation of spherical voids. Starting with a phenomenological explanation of the Kirkendall effect we briefly discuss the consequences on the reliability of microelectronics. A constitutive model for void nucleation and growth is presented, which can be used to predict the temporal development of voids in solder joints during thermal cycling. We end with exemplary numerical studies and discuss the potential of the results for the failure analysis of joining connections.