Evaluation of the thermal and hydraulic performances of a very thin sintered copper flat heat pipe for 3D microsystem packages
S. Tzanova, L. Kamenova, Y. Avenas, Ch. Schaeffer (CIME)

TL;DR
This study combines numerical modeling and experimental validation to evaluate a very thin sintered copper flat heat pipe's thermal and hydraulic performance, aiming to improve passive cooling in high-density 3D microsystem packages, especially for avionics.
Contribution
It introduces a validated 2D numerical hydraulic model for optimizing the design of ultra-thin copper heat pipes used in high-power microsystems.
Findings
Model accurately predicts liquid and vapor pressures.
Experimental results validate the numerical model.
Design optimization potential for high-density electronic cooling.
Abstract
The reported research work presents numerical studies validated by experimental results of a flat micro heat pipe with sintered copper wick structure. The objectives of this project are to produce and demonstrate the efficiency of the passive cooling technology (heat pipe) integrated in a very thin electronic substrate that is a part of a multifunctional 3-D electronic package. The enhanced technology is dedicated to the thermal management of high dissipative microsystems having heat densities of more than 10W/cm2. Future applications are envisaged in the avionics sector. In this research 2D numerical hydraulic model has been developed to investigate the performance of a very thin flat micro heat pipe with sintered copper wick structure, using water as a refrigerant. Finite difference method has been used to develop the model. The model has been used to determine the mass transfer and…
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
Taxonomy
TopicsHeat Transfer and Boiling Studies · Heat Transfer and Optimization · Refrigeration and Air Conditioning Technologies
