Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems

TL;DR

This paper discusses the complex interconnect challenges in integrating MEMS devices with ASICs for advanced sensor systems, focusing on various interconnection technologies and their constraints in creating compact, high-performance sensor packages.

Contribution

It provides a comprehensive analysis of interconnect challenges and solutions in MEMS/ASIC integration, highlighting specific technical constraints and potential approaches for chip-scale system packaging.

Findings

Identification of key interconnect challenges in MEMS/ASIC integration

Evaluation of interconnect technologies like post-CMOS feedthroughs and solder balling

Insights into process constraints for high-density sensor packaging

Abstract

Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of movements in all spatial dimensions requires a large toolbox of interconnect technologies, each with its own constraints regarding the total process integration. Specific challenges described in this paper are post-CMOS feedthroughs, front-to-front die contact arrays, vacuum-compliant lateral interconnect and fine-pitch solder balling to finally form a Chip-Scale System-in-Package (CSSiP).