Towards a Methodology for Analysis of Interconnect Structures for 3D-Integration of Micro Systems

TL;DR

This paper proposes a modular methodology for analyzing interconnect structures in 3D micro system integration, combining detailed PDE-based modeling with system-level simulation to improve design accuracy.

Contribution

It introduces a modular approach that integrates PDE solvers and model generation for comprehensive analysis of 3D micro system interconnects.

Findings

Enhanced modeling accuracy for 3D interconnects

Integration of detailed PDE analysis with system simulation

Facilitates better design decisions in 3D micro systems

Abstract

Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be provided to designers. Due to the variety of structures and effects of different physical domains, efficient modeling approaches and simulation algorithms have to be combined. The paper describes a modular approach which covers detailed analysis with PDE solvers and model generation for system level simulation.