Formation of Embedded Microstructures by Thermal Activated Solvent Bonding

TL;DR

This paper introduces a thermal activated solvent bonding method for creating embedded microstructures in polymers, which operates at lower temperatures and loads than traditional thermal bonding, with strong shear and pressure resistance.

Contribution

The paper presents a novel thermal activated solvent bonding technique that enables embedded microstructure formation in polymers at lower temperatures and loads.

Findings

Bonding shear strength up to 2.9 MPa.

Microfluidic devices withstand at least 6 bars of internal pressure.

Technique applicable to various polymer-solvent systems.

Abstract

We present a thermal activated solvent bonding technique for the formation of embedded microstrucutres in polymer. It is based on the temperature dependent solubility of polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the polymer, creating a bonding capability through segmental or chain interdiffusion at the bonding interface. The technique has advantages over the more commonly used thermal bonding due to its much lower operation temperature (30 degrees C lower than the material's Tg), lower load, as well as shorter time. Lap shear test indicated bonding shear strength of up to 2.9 MPa. Leak test based on the bubble emission technique showed that the bonded microfluidic device can withstand at least 6 bars (87 psi) of internal pressure (gauge) in the microchannel. This technique can be applied to other systems of polymer and solvent.