An Integrated Circuit Compatible Compact Package for Thermal Gas Flowmeters

TL;DR

This paper introduces a novel compact packaging method for thermal gas flowmeters using a plastic adapter sealed by a thermal process, enabling efficient fluid flow and protection of sensor components.

Contribution

It presents an original, integrated circuit compatible packaging technique that enhances the design and functionality of thermal mass flow sensors.

Findings

Successful fabrication of a compact flow sensor

Effective sealing of the adapter to the chip surface

Improved fluid flow management to reduce contact with pads

Abstract

An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described.