High Performance Thermal Interface Technology Overview

TL;DR

This paper reviews recent advances in thermal interface technology, highlighting a novel approach that creates thinner bondlines with enhanced thermal performance and improved reliability through hierarchical surface channels and particle-filled materials.

Contribution

It introduces a new thermal interface technology utilizing hierarchical surface channels for better particle stacking and lower assembly pressures, improving thermal performance and durability.

Findings

Thinner bondlines with 2-3 times improved thermal conductivity

Enhanced reliability with decreased thermal resistance after cycling

Longer overall lifetime compared to flat interfaces

Abstract

An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly pressures. This is achieved using nested hierarchical surface channels to control the particle stacking with highly particle-filled materials. Reliability testing with thermal cycling has also demonstrated a decrease in thermal resistance after extended times with longer overall lifetime compared to a flat interface.