A New Methodology for Extraction of Dynamic Compact Thermal Models

TL;DR

This paper introduces a novel methodology for extracting dynamic compact thermal models in multi-chip power electronics, effectively capturing thermal coupling and reducing simulation requirements.

Contribution

It presents a new approach based on the Optimal Thermal Coupling Point, enabling accurate transient modeling with fewer 3D thermal simulations or measurements.

Findings

Reduces the number of required 3D thermal simulations

Accurately models thermal coupling between heat sources

Validates the approach for transient electro-thermal analysis

Abstract

An innovative and accurate dynamic Compact Thermal Model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily be taken into account by system designers. The method is based on a definition of the Optimal Thermal Coupling Point, which is proven to be valid even for transient modelling. Compared to the existing methods, the number of needed 3D thermal simulations or measurements is significantly reduced.