Improvements of the Variable Thermal Resistance

TL;DR

This paper presents enhancements to a variable thermal resistance device, focusing on reducing settling time, improving dynamic impedance, expanding resistance range, and enabling negative thermal resistances through a new heat flux sensor integration.

Contribution

The paper introduces a new design that improves the performance and capabilities of electronically variable thermal resistance devices, including negative resistance realization.

Findings

Reduced settling time and dynamic thermal impedance.

Expanded range of thermal resistance, including negative values.

Enhanced control through integrated heat flux sensor.

Abstract

A flat mounting unit with electronically variable thermal resistance [1] has been presented in the last year [2]. The design was based on a Peltier cell and the appropriate control electronics and software. The device is devoted especially to the thermal characterization of packages, e.g. in dual cold plate arrangements. Although this design meets the requirements of the static measurement we are intended to improve its parameters as the settling time and dynamic thermal impedance and the range of realized thermal resistance. The new design applies the heat flux sensor developed by our team as well [3], making easier the control of the device. This development allows even the realization of negative thermal resistances.