Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers

TL;DR

This study presents vibration combined high temperature cycle tests on packaged capacitive SOI-MEMS accelerometers to assess reliability, revealing early degradation in some samples through statistical analysis.

Contribution

It introduces a testing methodology combining thermal cycling and vibration for MEMS accelerometers to inform reliability design.

Findings

Degradation observed in 3 out of 5 samples

High temperature and vibration impact on device reliability

Statistical evaluation provides insights into failure modes

Abstract

In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for Reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME - DED. Twenty thermal cycles of combined Temperature Cycle Test and Fatigue Vibration Test has been carried out on 5 samples. Statistical evaluation of the test results showed that degradation has started in 3 out of the 5 samples.