New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors

TL;DR

This paper introduces a new method for assessing solder joint reliability in BGA packages by accounting for interactions between design factors, improving early-stage design evaluation accuracy.

Contribution

It develops a quantification approach for interactions between design factors affecting BGA reliability, incorporating clustering and response surface modeling.

Findings

Interaction between design factors significantly affects solder joint reliability.

The proposed method accurately predicts inelastic strain range considering interactions.

Design evaluation at the concept stage is improved with the new assessment approach.

Abstract

As the integration and the miniaturization of electronics devices, design space become narrower and interactions between design factors affect their reliability. This paper presents a methodology of quantifying the interaction of each design factor in electronics devices. Thermal fatigue reliability of BGA assembly was assessed with the consideration of the interaction between design factors. Sensitivity analysis shows the influence of each design factor to inelastic strain range of a solder joint characterizing the thermal fatigue life if no interaction occurs. However, there is the interaction in BGA assembly since inelastic strain range depends on not only a mismatch in CTE but also a warpage of components. Clustering can help engineers to clarify the relation between design factors. The variation in the influence was taken to quantify the interaction of each design factor. Based on the interaction, simple evaluating approach of inelastic strain range for the BGA assembly was also developed. BGA package was simplified into a homogeneous component and equivalent CTE wascalculated from the warpage of BGA and PCB. The estimated equation was derived by using the response surface method as a function of design factors. Based upon these analytical results, design engineers can rate each factor's effect on reliability and assess the reliability of their basic design plan at the concept design stage.