Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package

TL;DR

This paper compares the thermal performance of epoxy and solder die attaches in a modern power package through measurements and simulations, revealing their impact on heat dissipation in ASICs.

Contribution

It provides a detailed comparison of epoxy and solder die attaches using thermal measurements and simulations in a state-of-the-art power package.

Findings

Solder die attach shows improved thermal conductivity over epoxy.

Transient thermal behavior differs significantly between the two materials.

The choice of die attach material affects overall package thermal performance.

Abstract

Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).