Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array

TL;DR

This paper presents a novel contactless thermal characterization method for PCBs using an IR sensor array, enabling real-time temperature mapping of circuits in operational systems.

Contribution

It introduces a quasi real-time IR-based thermal characterization technique for PCBs, allowing in situ temperature monitoring without physical contact.

Findings

Feasibility demonstrated for IR-based PCB thermal mapping

Method enables quasi real-time temperature distribution monitoring

Suitable for in situ measurements among operating system components

Abstract

In this paper the feasibility study of an IR sensor card is presented. The methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation is introduced. With the proposed method the IR radiation-distribution of boards from the close proximity of the sensor card is monitored in quasi real-time. The proposed method is enabling in situ IR measurement among operating cards of a system e.g. in a rack.