A Novel Contact Resistance Model of Anisotropic Conductive Film for FPD Packaging

TL;DR

This paper introduces a new contact resistance model for FPD packaging that improves prediction accuracy over existing models, validated using experiments with anisotropic conductive films containing 3-micron particles.

Contribution

A novel contact resistance model based on layer resistance concepts for FPD packaging, demonstrating three-fold improvement over previous models.

Findings

Predicted resistance closely matches experimental data, with only one-third deviation.

Gold bump significantly influences overall contact resistance.

Model shows three-fold accuracy improvement over existing models.

Abstract

In this research, a novel contact resistance model for the flat panel display (FPD) packaging based on the within layer parallel and between layers series resistance concepts was proposed. The FJ2530 anisotropic conductive films (ACF) by Sony Inc. containing the currently smallest 3micron conductive particles was used to conduct the experiments to verify the accuracy of the proposed model. Calculated resistance of the chip-on-glass (COG) packaging by the proposed model is 0.163\Omega. It is found that the gold bump with 0.162\Omega resistance play the major role of the overall resistance. Although the predicted resistance by the proposed model is only one third of the experimentally measured value, it has been three-fold improvement compared to the existing models.