Design and Development of Novel Electroplating Spring Frame Mems Structure Specimens for the Microtensile Testing of Thin Film Materials

TL;DR

This paper presents a novel electroplating spring frame MEMS specimen designed for precise microtensile testing of thin film materials, enhancing the measurement of mechanical properties at microscale.

Contribution

Introduction of a new MEMS structure specimen with integrated features for improved microtensile testing of thin films.

Findings

Successful fabrication of the novel MEMS specimen.

Compatibility with microtensile testing apparatus.

Potential for accurate mechanical property measurement.

Abstract

Microelectromechanical systems (MEMS) technologies are developing rapidly with increasing study of the design, fabrication and commercialization of microscale systems and devices. Accurate mechanical properties are important for successful design and development of MEMS. We have demonstrated here a novel electroplating spring frame MEMS Structure Specimen integrates pin-pin align holes, misalignment compensate spring structure frame, load sensor beam and freestanding thin film. The specimen can be fit into a specially designed microtensile apparatus which is capable of carrying out a series of tests on sub-micro scale freestanding thin films.