Packaging of RF Mems Switching Functions on Alumina Substrate

TL;DR

This paper discusses the importance of packaging technologies for RF MEMS switching devices on alumina substrates to facilitate their commercial deployment in wireless communication systems.

Contribution

It highlights the critical role of packaging solutions in advancing RF MEMS devices for practical wireless applications.

Findings

Packaging impacts RF MEMS device performance

Alumina substrates are suitable for RF MEMS packaging

Addressing packaging challenges accelerates commercialization

Abstract

Recently the strong demands in wireless communication requires expanding development for the application of RF MEMS (Radio Frequency micro electro mechanical systems) sensing devices such as micro-switches, tunable capacitors because it offers lower power consumption, lower losses, higher linearity and higher Q factors compared with conventional communications components. To accelerate commercialisation of RF MEMS products, development for packaging technologies is one of the most critical issues should be solved beforehand.