3-D Self-Assembled Soi Mems: An Example of Multiphysics Simulation

TL;DR

This paper discusses the use of multiphysics simulations to model 3-D self-assembled SOI MEMS devices, highlighting their applications like thermal actuators and flow sensors, with a focus on coupled structural and thermal analysis.

Contribution

It demonstrates the importance of coupled multiphysics simulation for accurately modeling 3-D SOI MEMS devices and explores their potential applications.

Findings

Successful simulation of thermal and structural behavior

Identification of key multiphysics interactions in MEMS

Potential applications in sensors and actuators

Abstract

MEMS devices are typical systems where multiphysics simulations are unavoidable. In this work, we present possible applications of 3-D self-assembled SOI (Silicon-on-Insulator) MEMS such as, for instance, thermal actuators and flow sensors. The numerical simulations of these microsystems are presented. Structural and thermal parts have to be strongly coupled for correctly describing the fabrication process and for simulating the behavior of these 3-D SOI MEMS.