Microsystem Product Development
M.-A. Polosky, E.-J. Garcia

TL;DR
This paper discusses the evolution and challenges of microsystem product development, emphasizing the importance of comprehensive planning in tooling, fixtures, and process integration to ensure successful MEMS product realization.
Contribution
It highlights the need for thorough upfront planning of all development elements beyond design and fabrication in MEMS projects.
Findings
Packaging processes are rapidly maturing.
Product development involves multiple overlooked elements.
Thorough planning is crucial for success.
Abstract
Over the last decade the successful design and fabrication of complex MEMS (MicroElectroMechanical Systems), optical circuits and ASICs have been demonstrated. Packaging and integration processes have lagged behind MEMS research but are rapidly maturing. As packaging processes evolve, a new challenge presents itself, microsystem product development. Product development entails the maturation of the design and all the processes needed to successfully produce a product. Elements such as tooling design, fixtures, gages, testers, inspection, work instructions, process planning, etc., are often overlooked as MEMS engineers concentrate on design, fabrication and packaging processes. Thorough, up-front planning of product development efforts is crucial to the success of any project.
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Taxonomy
TopicsAdvanced MEMS and NEMS Technologies · 3D IC and TSV technologies · Modular Robots and Swarm Intelligence
