BCB Based Packaging for Low Actuation Voltage RF MEMS Devices

TL;DR

This paper presents a novel packaging approach for RF MEMS devices that reduces actuation voltage and minimizes microwave loss through multiphysics simulation and optimized architecture.

Contribution

It introduces a new packaging design and modeling methodology specifically aimed at lowering actuation voltage and improving microwave performance in RF MEMS.

Findings

Successfully modeled capacitive contacts using multiphysics simulation

Developed a packaging architecture with very low microwave loss

Optimized packaging process through simulation-driven design

Abstract

This paper outlines the issues related to RF MEMS packaging and low actuation voltage. An original approach is presented concerning the modeling of capacitive contacts using multiphysics simulation and advanced characterization. A similar approach is used concerning packaging development where multi-physics simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range.