Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors

TL;DR

This paper presents a method to evaluate the reliability of BGA electronic device packages by analyzing the interactions between design factors using response surface and cluster analysis, aiding early-stage design decisions.

Contribution

It introduces a novel approach combining response surface and cluster analysis to clarify interactions among design factors affecting BGA reliability.

Findings

Interaction of design factors clarified

Design factors' effects on reliability rated

Reliability assessment at concept design stage

Abstract

The recent development of electric and electronic devices has been remarkable. The miniaturization of electronic devices and high integration are progressing by advances in mounting technology. As a result, the reliability of fatigue life has been prioritized as an important concern, since the thermal expansion difference between a package and printed circuit board causes thermal fatigue. It is demanded a long-life product which has short development time. However, it is difficult because of interaction between each design factor. The authors have investigated the influence of various design factors on the reliability of soldered joints in BGA model by using response surface method and cluster analysis. By using these techniques, the interaction of all design factors was clarified. Based upon the analytical results, design engineers can rate each factor's effect on reliability and assess the reliability of their basic design plan at the concept design stage.