Design issues of a variable thermal resistance

TL;DR

This paper discusses the design challenges and solutions for a practical, electronically variable thermal resistance device intended for package thermal qualification and modeling.

Contribution

It addresses design issues and proposes solutions for a matured, practical variable thermal resistance device based on previous feasibility demonstrations.

Findings

Identified key design problems for practical implementation

Proposed solutions to improve device reliability and usability

Outlined steps for integrating the device into thermal qualification processes

Abstract

Some years ago we have proposed a thermal mount with electronically variable thermal resistance [1]. In this earlier work the feasibility of such a structure has been demonstrated. Now we intend to realize this mount in a maturated form, suitable to the everyday use in the practice of package thermal qualification and modeling. The design of such a device raises a number of new questions and problems. The present paper is dealing with these problems and the possible solutions.