Advanced Compact Thermal Modeling by using VHDL-AMS
W. Habra (LAAS), P. Tounsi (LAAS), J.-M. Dorkel (LAAS)

TL;DR
This paper introduces an advanced methodology for creating boundary condition independent compact thermal models using VHDL-AMS, accounting for nonlinear thermal conductivities in multi-chip systems.
Contribution
It presents a novel approach to generate BC-independent CTMs with nonlinear thermal properties using VHDL-AMS modeling language.
Findings
BCI CTMs enable more accurate thermal simulations
Method accounts for nonlinear thermal conductivities
Applicable to multi-chip components and systems
Abstract
This paper presents an improved methodology to generate Compact Thermal Models "CTMs" by using (VHDL-AMS) modeling language. This methodology makes it possible to have Boundary Conditions Independent "BCI" CTMs for multi chip components and systems while taking into account the nonlinear thermal conductivity of semiconductors and other materials.
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Taxonomy
TopicsAdvancements in Semiconductor Devices and Circuit Design · Low-power high-performance VLSI design · Semiconductor materials and devices
