Pi-Molecular dielectric layer for organic thin film diode

TL;DR

This paper reports the integration of ultra-thin self-assembled organic dielectric monolayers into organic thin-film diodes, enhancing their electrical properties with stable, high-capacitance insulating layers.

Contribution

It introduces a novel fabrication of ultra-thin, self-assembled organosiloxane dielectric layers for improved organic thin-film diode performance.

Findings

High capacitance (~150 nF/cm² at -3V)

Low leakage current (~10^-5 A/cm² at -1V)

Stable, adherent, thermally resistant dielectric films

Abstract

Very thin (1.2-2.5nm) self-assembled organic dielectric monolayers have been integrated into organic thin-film diode to achieve electrical characteristics. These dielectrics are fabricated by self-assembling deposition, resulting in smooth, strongly adherent, thermally stable, organosiloxane thin films having interesting electrical capacitances (around 150 nF cm-2 at -3V) and insulating properties (leakage current densities around 10-5 A cm2 at -1V).