Kinetics of Electrodeposition of Silver and Copper at Template Synthesis of Nanowires

TL;DR

This study investigates the kinetics of electrodeposition of silver and copper into nanoporous membranes, analyzing how different current modes affect pore filling, deposit thickness, and morphology.

Contribution

It provides new insights into how pulse and direct currents influence metal deposition rates and pore filling in nanoporous templates.

Findings

Higher deposit thickness achieved with pulse currents.

Deposition rates depend on charge passed and current mode.

Morphology and microstructure characterized by SEM and EDX.

Abstract

The results of investigation of kinetics of nanopores filling into membranes from aluminum oxide (pore diameter - 200 nm, porosity ~ 50%) at electrodeposition of copper and silver are described. It is shown, that at identical quantity of electricity passed through solutions, the degree of pores filling by metal (average thickness of a deposit) is various for copper and silver deposition. Calculated (according Faraday Law) and experimental dependences of deposition rates of these metals on quantity of electricity passed at direct and pulse currents are presented. Galvanodynamic i - v dependences have been obtained at various current scanning rates. The smaller rate of deposition allows to decrease concentration limitations of electrode process and to obtain higher average thickness of metal deposits and higher filling degree. The limiting values of quantity of electricity for direct and pulse currents were determined. The average thickness of silver and copper deposits was obtained. A degree of pores filling, the morphology and chemical microanalysis were studied on cross-section of the membrane, using TESCAN SEM equipped with an Oxford Instruments INCA Enerqy EDX-system.